Dual Programmable Transient Voltage Suppressor

This device has been especially designed to protect 2 new high voltage, as well as classical SLICs, against transient over-voltages.

Positive over-voltages are clamped by 2 diodes. Negative surges are suppressed by 2 thyristors, their breakdown voltage being referenced to –VBAT through the gate.

This component presents a very low gate triggering current (IGT) in order to reduce the current consumption on printed circuit board during the firing phase.

These devices are not subject to aging and provide a fail safe mode in the short circuit for better protection. UPG are used to help equipment to meet various standards such as UL1950, IEC950 / CSA C22.2, UL1459 and FCC part68.

Features

  • Dual-line programmable transient voltage suppressor
  • Wide negative firing voltage range: VMGL = -155V
  • Low dynamic switching voltages: VFP and VDGL
  • Low gate triggering current: IGT = 5 mA max
  • Peak pulse current: IPP = 30 A (10/1000 s)
  • Holding current: IH > 150 mA
  • Solid-state silicon technology
  • Meets MSL 1 Requirements
  • ROHS compliant
  • Weight : 0.08 gram(approx.).

Application

  • T-1/E-1, ISDN, and xDSL transmission equipment
  • Telecommunications infrastructure
  • PBX’s and other switches
  • Set-top box
  • VoIP

Maximum ratings (Tamb=25°C Unless Otherwise Specified)

Parameter

Symbol

Value

Unit

Repetitive peak off-state voltage

VGK =0

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UPG1069B

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VDRM

-170

V

Repetitive peak gate-cathode voltage

VKA=0

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UPG1069B

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VGKRM

-170

V

Non-repetitive peak on-state current

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10/1000 us (Telcordia(Bellcore)Gr-1089-CORE.Issue 2.February 1999

Section4)

IPPSM

30

5/320 us (ITU-T K.20

K.21& K.45

K.44 open-circuit voltage wave shape 10/700us)

40

1.2/50 us (Telcordia(Bellcore)Gr-1089-CORE.Issue 2.February 1999

Section4)

100

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2/10 us (Telcordia(Bellcore)Gr-1089-CORE.Issue 2.February 1999

Section4)

120

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Non-repetitive peak on-state current. VGG=-75V 50Hz to 60Hz

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0.1 s

ITSM

11

A

1 s

4.8

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5 s

2.7

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300 s

0.95

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900 s

0.93

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Lead Soldering Temperature

TL

260 (10 sec.)

°C

Operating Temperature Range

TJ

-40 ~ 85

°C

Storage Temperature Range

TSTG

-55 ~ 150

°C

Lead Solder Temperature − Maximum (10 Second Duration)

TL

260

°C

Junction To ambient

RθJA

170

°C/W

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded

device functional operation is not implied

damage may occur and reliability may be affected.

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*Other voltages may be available upon request.

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Download datasheet in PDF format.